7 A H-Bridge for DC-Motor Applications
TLE 6209 R
Data Sheet
1
Overview
1.1
Features
• • • • • • • • • • • • • • • • • •
Delivers up to 6 A continuous and 7 A peak current Optimized for DC motor management applications Very low RDS ON of typ. 150 mΩ @ 25 °C per switch Operates at supply voltages of up to 40V Overvoltage Protection against transients up to 45 V Outputs fully short circuit protected PG-DSO-20-37, -65 Standard SPI-Interface, daisy chain capability Adjustable chopper current regulation of up to 7 A Temperature monitor with prewarning, warning and shutdown Over- and Undervoltage-Lockout Open load detection Detailed load failure diagnosis by SPI Minimized power dissipation due to active free-wheeling Low EMI due to voltage slope regulation Very low current consumption (typ. 20 μA @ 25 °C) in stand-by (Inhibit) mode Enhanced power PG-DSO-Package Green Product (RoHS compliant) AEC Qualified
Type
Package
TLE 6209 R
PG-DSO-20-37, -65
Functional Description The TLE 6209 R is an integrated power H-Bridge with D-MOS output stages for driving bidirectional loads such as DC-Motors. The design is based on Infineons Smart Power Technology SPT which allows bipolar, CMOS and power D-MOS devices on the same monolithic circuit. Operation modes forward (cw), reverse (ccw) and brake are invoked by two control pins PWM and DIR. Protection and a reliable diagnosis of overcurrent, openload, short-circuit to ground, to the supply voltage or across the load are integrated. Detailed diagnostic
Data Sheet, Rev.3.2
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information is given via the 8 bit SPI status word. An integrated chopper current limitation limits the current e.g. to reduce power dissipation during mechanical block of a DC motor. Several device parameters can be set by the SPI control word. A three-level temperature monitoring with prewarning, warning and shutdown is included for controlled operation under critical power loss conditions. The full protection and diagnosis capability make the device suitable especially for safety relevant applications, e.g. in automotive ECUs. 1.2
Pin Configuration (top view)
TLE 6209R 1
GND
GND
20
2
OUT 1
OUT 2
19
3
OUT 1
OUT 2
18
VS
VS
5
SCLK
DRV
6
SDI
VCC
15
7
SDO
PWM
14
8
CSN
DIR
13
9
INH
DIS
12
10
GND
GND
11
4
17
16
Metal slug, connected to GND
Pin Definitions and Functions
VS
Power Supply Voltage
VCC
5 V Logic Supply
DRV
Input for Charge pump buffer capacitor
GND
Ground
SDI
Serial Data Input
SDO
Serial Data Output
SCLK
Serial Clock Input
CSN
Chip-Select-Not Input
OUT
Power Output
–
–
PWM
PWM Input
DIR
Direction Input
DIS
Disable Input
INH
Inhibit
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1.2.1
Pin Definitions and Functions
Pin No. Symbol Function 1, 10, 11, 20
GND
Ground; internally connected to cooling tab (heat slug); to reduce thermal resistance place cooling areas and thermal vias on PCB.
2,3
OUT1
Output 1; output of D-MOS half bridge 1; external connection between pin 2 and pin 3 is necessary.
4,17
VS
Power supply; needs a blocking capacitor as close as possible to GND; 47 μF electrolytic in parallel to 220 nF ceramic is recommended; external connection between pin 4 and pin 17 is necessary.
5
SCLK
Serial clock input; clocks the shiftregister; SCLK has an internal active pull down and requires CMOS logic levels
6
SDI
Serial data input; receives serial data from the control device; serial data transmitted to SDI is an 8 bit control word with the Least Significant Bit (LSB) being transferred first; the input has an active pull down and requires CMOS logic levels; SDI will accept data on the falling edge of SCLK-signal; see Table 1 for input data protocol.
7
SDO
Serial-Data-Output; this tri-state output transfers diagnosis data to the control device; the output will remain tri-stated unless the device is selected by a low on Chip-Select-Not (CSN); SDO state changes on the rising edge of SCLK; see Table 4 for diagnosis protocol.
8
CSN
Chip-Select-Not input; CSN is an active low input; serial communication is enabled by pulling the CSN terminal low; CSN input should only be transitioned when SCLK is low; CSN has an internal active pull up and requires CMOS logic levels.
9
INH
Inhibit input; has an internal pull down; device is switched in standby condition by pulling the INH terminal low.
12
DIS
Disable input; has an internal pull up; the output stages are switched in tristate condition by pulling the DIS terminal high.
13
DIR
Direction input; has an internal pull down; TTL/CMOS compatible input.
14
PWM
PWM input; has an internal pull down; TTL/CMOS compatible input.
15
VCC
Logic supply voltage; needs a blocking capacitor as close as possible to GND; 10 μF electrolytic in parallel to 220 nF ceramic is recommended.
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1.2.1
Pin Definitions and Functions (cont’d)
Pin No. Symbol Function 16
DRV
Drive; Input for external charge pump capacitor CDRV
18,19
OUT2
Output 2; output of D-MOS half bridge 2; external connection between pin 2 and pin 3 is necessary.
1.3
Functional Block Diagram
INH DIS CSN SDI SCLK SDO PWM DIR
9
VCC
DRV
15
16
Bias
Charge Pump
Inhibit
FaultDetect
12 8 6 5 7
S P I
14
VS 4,17
Driver 8 Bit Logic and Latch
2,3
OUT 1
& 18,19
GateControl
OUT 2
Direct Input
13 UV OV
≥1
TSD 1,10,11,20 GND
Figure 1
Block Diagram
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2
Circuit Description
2.1
Serial Peripheral Interface (SPI)
The SPI is used for bidirectional communication with a control unit. The 8-bit programming word or control word (see Table 1) is read in via the SDI serial data input, and this is synchronized with the serial clock input SCLK. The status word appears synchronously at the SDO serial data output (see Table 4). The transmission cycle begins when the chip is selected with the chip-select-not (CSN) input (H to L). When the CSN input changes from L to H, the word which has been read into the shift register becomes the control word. The SDO output switches then to tristate status, thereby releasing the SDO bus circuit for other uses. The SPI allows to parallel multiple SPI devices by using multiple CSN lines. Due to the full duplex shift register, the TLE 6209 R can also be used in daisy-chain configuration. The settings made by the SPI control word become active at the end of the SPI transmission and remain valid until a different control word is transmitted or a power on reset occurs. At each SPI transmission, the diagnosis bits as currently valid in the error logic are transmitted. The behavior of the diagnosis bits is described in Section 2.5. Table 1
Input Data Protocol
Bit 7
Status Register Reset: H = reset
6
OVLO: H = on, L = off
5
not used
4
MSB of 2bit chopper-OFF-time
3
LSB of 2bit chopper-OFF-time
2
PWM Operation mode: H = Fast decay, L = Slow decay
1
MSB of 2 bit chopper current limit
0
LSB of 2 bit chopper current limit
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Table 2
Programmable Chopper Current Limit IL_xx
Bit 1
Bit 0
Current limit
0
0
0
1
1
0
1
1
IL_00 IL_01 IL_10 IL_11
Note: For actual values, see page 16 Table 3
Programmable Chopper OFF-time tOFF_xx
Bit 4
Bit 3
Chopper-OFF-time
tOFF_00 tOFF_01 tOFF_10 tOFF_11
0
0
0
1
1
0
1
1
Note: For actual values, see page 16 Table 4
Diagnosis Data Protocol
Bit
H = Error/L = no error
7
Power supply fail
6
not used, always H
5
Short to VS or across the load
4
Short to GND
3
Open load
2
MSB of Temperature Monitoring
1
LSB of Temperature Monitoring
0
Error-Flag
Table 5
Temperature Monitoring
Bit 2
Bit 1
Chip Temperature
0
0
Below Prewarning
0
1
Temperature Prewarning
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Table 5
Temperature Monitoring
Bit 2
Bit 1
Chip Temperature
1
0
Temperature Warning
1
1
Overtemperature Shutdown
2.2
Supply
2.2.1
Logic Supply Voltage, Power-On-Reset
The logic is supplied with 5 V by the VCC pin, separated from the power stage supply VS. The advantage of this system is that information stored in the logic remains intact even in the event of failures in the supply voltage VS. The power supply failure information can be read out via the SPI. If VCC falls below typically 4.5 V, the logic is shut down, all internally stored data is deleted and the Output Stages are switched to tristate. The IC is restarted on rising VCC with a hysteresis of typically 80 mV After this restart at increasing VCC, or if the device is activated after having been set into inhibit mode (INH L to H), the IC is initialized by Power-On-Reset (POR). After POR, all SPI control bits are set to L. This setting remains valid until first SPI communication. Also the error bits are reset by POR. 2.2.2
Power Supply Voltage
The power stages are connected to the supply voltage VS. This voltage is monitored by over voltage (OV) and under voltage (UV) comparators as described in Section 2.5.6. The power supply voltage needs a blocking capacitor to GND. 2.3
Direct Inputs
2.3.1
Inhibit (sleep mode)
The INH input can be used to cut off the complete IC. By pulling the INH input to low, the power stages are switched to tristate, and the current consumption is reduced to just a few μA at both the VS and the VCC input. It also leads to the loss of any data stored. The TLE 6209 R is reinitialized with POR if INH is put to high again. The pin has an internal pull-down. 2.3.2
Disable
The DIS input can be used to disable the output stages. By pulling the DIS input to high the power stages are switched to tristate, regardless of the signals at the DIR and PWM inputs. The DIS input can be used as an emergency disable without resetting the SPI data stored in the IC. It has an internal pull-up.
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2.3.3
Direction and PWM
The power stages are controlled by the direct inputs DIR and PWM as given in Table 6 and further illustrated in Figure 2. The DIR input gives the direction of output current, while the PWM input controls whether the current is increased or reduced. The SPI control bit 2 sets the decay mode, i.e. determines what happens if PWM = L. In pulsewidth modulated applications, this control scheme allows to supply the PWM-signal always through the same port, using less controller resources. Table 6
Functional Truth Table
DIR
PWM
MODE (Bit 2)
OUT1
OUT2
Comments
0
1
0 (slow decay)
H
L
Motor turns clockwise
0
0
1
1
1
0
0
1
0
0
1 (fast decay)
H
H
Freewheel with slow decay
L
H
Motor turns counterclockwise
H
H
Freewheel with slow decay
H
L
Motor turns clockwise
L
H
Fast decay
1
1
L
H
Motor turns counterclockwise
1
0
H
L
Fast decay
Slow Decay PWM = H
PWM = L
M
M
Fast Decay
Figure 2
PWM = H
PWM = L
M
M
DIR/PWM Control with Slow- and Fast Decay
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2.4
Power Stages
The output stages consist of a DMOS H-bridge built by two highside switches and two lowside switches. Integrated circuits protect the outputs against overcurrent and overtemperature if there is a short-circuit to ground or to the supply voltage or across the load. Positive and negative voltage spikes, which occur when switching inductive loads, are limited by integrated freewheeling diodes. 2.4.1
Charge Pump
To realize the fast switching times, the charge pump, which generates the voltage necessary to switch on the n-channel D-MOS high-side switches, must be highly efficient. It requires an external capacitor CDRV which is connected to VS and the charge pump buffer input, DRV. It should be placed as close to the pins as possible. 2.4.2
Chopper Current Limitation
To limit the output current, a chopper current limitation is integrated as shown in Figure 3. The current is measured by sense cells integrated in the low-side switches. As soon the current limit IL is reached, the low-side switch is switched off for a fixed time tOFF. IL and tOFF can be set by the SPI control bits 0,1, 3 and 4.
IOUT
current limit IL
off-time tOFF time
Figure 3 2.4.3
Chopper current limitation Active Freewheeling
When drivng inductive loads with PWM operation, the dissipated power can be significantly reduced by activating the transistor located parallel to the internal freewheeling diode. This is realized in the TLE 6209 R. When switching an output from L to H, the high-side switch is turned on after a certain dead-time to avoid cross currents flowing through the half bridge.
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2.5
Protection and Diagnosis
2.5.1
Short of Output to Ground
The high-side switches are protected against a short of the output to ground by an over current shutdown. If a high-side switch is turned on and the current rises above the highside shutdown threshold ISDH for longer than the shutdown delay time tdOC, all output transistors are turned off and bit 4 the SPI diagnosis word is set. During the delay time, the current is limited to ISC (typically 20 A). The output stages stay off and the error bit set until a status register reset (bit 7 of SPI control word) is received or a power-on reset is performed. 2.5.2
Short of Output to VS
Due to the chopper current regulation, the low-side switches are protected against a short to the supply voltage. To detect the short, the first time the current limit is reached, the off-command for the low-side switch is blanked out for 10 μs. If the current rises above the low-side shutdown threshold ISDL during this time, all output transistors are turned off and bit 5 in the SPI diagnosis word is set. The value of the shutdown threshold depends on the current limit that is set via the SPI. The shutdown threshold is 1 A higher than the current limit. The output stages stay off and the error bit set until a status register reset (bit 7 of SPI control word) is received or a power-on reset is performed. 2.5.3
Short Across the Load
The short circuit protection circuits of the high- and low-side switches work independently of each other. In most cases, a short across the load will be detected as a short to VS because of the longer filter time in the high-side switches tdOC and the higher shutdown threshold ISDH. 2.5.4
Open Load
If the current through the low side transistor is lower than the reference current IdOL in ON-state (PWM = H), a timer is started. After a filter time tdOC an open load failure will be recognized and the status bit 3 is set. If the current exceeds the reference current IdOL the open load timer is reset. If the H-bridge is switched to OFF-state (PWM = L) the timer is stopped but not reset. The timer continues if the H-bridge is switched to ON-state again. There is no reset of the open load timer if the direction is changed using the DIR input in open load condition. The open load error bit is latched and can be reset by the status register reset bit 7 of the SPI control word or a POR. 2.5.5
Temperature Monitoring
Temperature sensors are integrated in the power stages. The temperature monitoring circuit compares the measured temperature to the prewarning, warning and shutdown Data Sheet, Version 3.2
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thresholds. As soon as a threshold is reached, the according status bits are set in the SPI diagnosis word (c.f. Table 5). If the overtemperature shutdown threshold is reached, the output stages are turned off. The temperature monitoring messages and the over temperature shutdown are latched and can be reset by the status register reset bit 7 of the SPI control word or a POR. 2.5.6
Power Supply Fail
The power supply Voltage is monitored for over- and under voltage lockout: • Under Voltage Lockout If the supply voltage VS drops below the switch off voltage VUV OFF, all output transistors are switched off and the power supply fail bit (bit 7 of the SPI diagnosis word) is set. If VS rises again and reaches the switch on voltage VUV ON, the power stages are restarted. The error bit, however, is latched and has to be reset by the status register reset bit 7 of the SPI control word. • Over Voltage Lockout If the supply voltage VS rises above the switch off voltage VOV OFF, all output transistors are switched off and the power supply fail bit (bit 7 of the SPI diagnosis word) is set. If VS falls again and reaches the switch on voltage VOV ON, the power stages are restarted. The error bit, however, is latched and has to be reset by the status register reset bit 7 of the SPI control word. The OVLO is only active if control bit 6 is H. If the bit is low, the OVLO is deactivated. 2.5.7
Error Flag
Bit 0 of the SPI diagnosis word is an OR of the status bits 1 to 7. It can be read out without full SPI communication as described in Figure 8.
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3
Characteristics
3.1
Absolute Maximum Ratings
Parameter
Symbol
Limit Values
Unit
Remarks
–
min.
max.
VS VS VCC VI
– 0.3
40
V
–1
45
V
t < 0.5 s; IS > – 2 A
– 0.3
5.5
V
0 V < VS < 40 V
– 0.3
5.5
V
0 V < VS < 40 V 0 V < VCC < 5.5 V
Logic output voltage (SDO)
VO
– 0.3
5.5
V
0 V < VS < 40 V 0 V < VCC < 5.5 V
Output voltage (OUT1, OUT2)
VOUT
– 0.3 V VS + 1,5V
–
0 V < VS < 40 V
Charge pump buffer voltage (DRV)
VDRV
VS – 0.3 V
VS + 15 V
–
0 V < VS < 40 V
IOUT IOUT
–
–
A
–
–
A
internally limited, see page 16 and page 17.
Tj Tstg
– 40
150
°C
–
– 50
150
°C
–
Voltages Supply voltage Supply voltage Logic supply voltage Logic input voltages (SDI, SCLK, CSN, INH, DIS, PWM, DIR)
Currents Output current (cont.) Output current (peak)
Temperatures Junction temperature Storage temperature
Note: Maximum ratings are absolute ratings; exceeding any one of these values may cause irreversible damage to the integrated circuit.
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3.2
Operating Range
Parameter
Symbol
Limit Values min.
Unit
Remarks
max.
Supply voltage
VS
VUV OFF 40
V
After VS rising above VUV ON
Supply voltage slew rate
dVS /dt
–10
10
V/μs
–
Logic supply voltage
VCC VS VS VI
4.75
5.50
V
– 0.3
Outputs in tristate
– 0.3
VUV ON V VUV OFF V VCC V
fCLK Tj
–
2
MHz
–
– 40
150
°C
–
Junction pin
RthjC
–
1.5
K/W
measured to pin 1, 10, 11, 20
Junction ambient
RthjA
–
50
K/W
–
Supply voltage increasing Supply voltage decreasing Logic input voltage (SDI, SCLK, CSN, INH) SPI clock frequency Junction temperature
– 0.3
– Outputs in tristate –
Thermal Resistances
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3.3
Electrical Characteristics
8 V < VS < 40 V; 4.75 V < VCC < 5.25 V; INH = High; all outputs open; – 40 °C < Tj < 150 °C; unless otherwise specified Parameter
Symbol
Limit Values min.
typ.
max.
Unit Test Conditions
Current Consumption Quiescent current
IS
–
–
50
μA
INH = Low; VS = 13.2 V
Quiescent current
IS
–
10
30
μA
INH = Low; VS = 13.2 V; Tj = 25 °C
Logic-Supply current
ICC ICC IS
–
–
20
μA
INH = Low
–
2.0
4.0
mA
–
–
2.8
5.0
mA
–
–
5.4
5.7
V
4.4
4.9
5.2
V
0.2
0.5
–
V
34
37
40
V
28
32
36
V
–
5.0
–
V
VS increasing VS decreasing VUV ON – VUV OFF VS increasing VS decreasing VOV OFF – VOV ON
Logic-Supply current Supply current
Over- and Under-Voltage Lockout UV-Switch-ON voltage UV-Switch-OFF voltage UV-ON/OFF-Hysteresis OV-Switch-OFF voltage OV-Switch-ON voltage OV-ON/OFF-Hysteresis
Data Sheet, Version 3.2
VUV ON VUV OFF VUV HY VOV OFF VOV ON VOV HY
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3.3
Electrical Characteristics (cont’d)
8 V < VS < 40 V; 4.75 V < VCC < 5.25 V; INH = High; all outputs open; – 40 °C < Tj < 150 °C; unless otherwise specified Parameter
Symbol
Limit Values min.
Unit Test Conditions
typ.
max.
140
170
mΩ
5.2 V < VS < 40 V Tj = 25 °C; CDRV = 33 nF
–
280
mΩ
5.2 V < VS < 40 V CDRV = 33 nF
130
160
mΩ
5.2 V < VS < 40 V Tj = 25 °C; CDRV = 33 nF
–
270
mΩ
5.2 V < VS < 40 V CDRV = 33 nF
–
1.0
1.5
V
–
1.0
1.5
V
IF = 3 A IF = 3 A
Outputs OUT1-2 Static Drain-Source-On Resistance Source (High-Side) IOUT = – 3 A
Sink (Low-Side) IOUT = 3 A
RDS ON H –
RDS ON L –
Clamp Diodes Forward Voltage Upper Lower
Data Sheet, Version 3.2
VFU VFL
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3.3
Electrical Characteristics (cont’d)
8 V < VS < 40 V; 4.75 V < VCC < 5.25 V; INH = High; all outputs open; – 40 °C < Tj < 150 °C; unless otherwise specified Parameter
Symbol
Limit Values
Unit Test Conditions
min.
typ.
max.
IOCD tdOC
30
–
130
mA
–
2
–
8
ms
–
Current limit
IL_00
3.4
4
4.6
A
Bit 0 = L; Bit 1 = L;
Current limit
IL_01
4.25
5
5.75
A
Bit 0 = H; Bit 1 = L;
Current limit
IL_10
5.1
6
6.9
A
Bit 0 = L; Bit 1 = H;
Current limit
IL_11
5.95
7
8.05
A
Bit 0 = H; Bit 1 = H;
0.5
1.0
1.5
A
ΔISDL = ISDL - IL
Open Circuit/Underload Detection Detection current Delay time Current Limits
Low-Side Switch Overcurrent Shutdown Threshold
ΔISDL
Note: low-side shutdown threshold is guaranteed by design Switch-OFF Time during Current Limitation (Chopper OFF-Time) OFF-time
tOFF_00
16
24
28
μs
Bit 3 = L; Bit 4 = L;
OFF-time
tOFF_01
32
43
51
μs
Bit 3 = H; Bit 4 = L;
OFF-time
tOFF_10
48
62
74
μs
Bit 3 = L; Bit 4 = H;
OFF-time
tOFF_11
64
80
96
μs
Bit 3 = H; Bit 4 = H;
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3.3
Electrical Characteristics (cont’d)
8 V < VS < 40 V; 4.75 V < VCC < 5.25 V; INH = High; all outputs open; – 40 °C < Tj < 150 °C; unless otherwise specified Parameter
Symbol
Limit Values min.
typ.
max.
Unit Test Conditions
High-Side Switch Overcurrent High-side shutdown threshold
ISDH
8
12
18
A
–
Shutdown delay time
tdSD ISC
15
25
40
μs
–
–
–
25
A
during tdSD
Short circuit current
Note: For short circuit current definition, see Figure 5. Short circuit current is guaranteed by design Leakage Current / Output Current in Tristate Source-Output-Stage Sink-Output-Stage
IQLH IQLL
– 120 – 50
–
μA
–
1
mA
VOUT = 0 V VOUT = VS
VS = 13.2 V,
0.5
Output Delay Times (device not in stand-by for t > 1 ms) High-side ON High-side OFF Low-side ON Low-side OFF
td ON H td OFF H td ON L td OFF L
–
4
10
μs
–
0.6
1
μs
–
2
3.5
μs
–
2.5
4
μs
Resistive load of 12 Ω
Output Switching Times (device not in stand-by for t > 1 ms) High-side switch rise time High-side switch fall time Low-side switch rise time Low-side switch fall time
tRISE H tFALL H tRISE L tFALL L
–
1.8
3.5
μs
–
0.2
0.8
μs
2
6.5
11
μs
2
4.3
6.5
μs
VS = 13.2 V,
Resistive load of 12 Ω
Note: For switching time definitions, see Figure 6.
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3.3
Electrical Characteristics (cont’d)
8 V < VS < 40 V; 4.75 V < VCC < 5.25 V; INH = High; all outputs open; – 40 °C < Tj < 150 °C; unless otherwise specified Parameter
Symbol
Limit Values min.
typ.
max.
–
–
0.7
0.2
–
50
300
10 –
H-input voltage threshold L-input voltage threshold
Unit Test Conditions
Inhibit Input
VIINHH L-input voltage threshold VIINHL Hysteresis of input voltage VIINHHY Pull down current (low) IIINHL Pull down current (high) IIINHH H-input voltage threshold
–
–
VCC VCC
500
mV
–
25
50
μA
–
80
μA
VIINH = 0.2 × VCC VIINH = 0.7 × VCC
–
–
0.7
–
–
VCC VCC
–
0.2 50
300
500
mV
–
– 50
– 25
– 10
μA
– 50
–
–
μA
VIDIS = 0.7 × VCC VIDIS = 0.2 × VCC
–
–
0.7
–
0.2
–
–
VCC VCC
50
300
500
mV
–
10
25
50
μA
–
–
50
μA
VI= 0.2 × VCC VI= 0.7 × VCC
–
Disable Input
VIDISH VIDISL Hysteresis of input voltage VIDISHY Pull up current (high) IIDISH Pull up current (low) IIDISL
–
Direction/PWM Input
VIH L-input voltage threshold VIL Hysteresis of input voltage VIHY Pull down current (low) II Pull down current (high) II H-input voltage threshold
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3.3
Electrical Characteristics (cont’d)
8 V < VS < 40 V; 4.75 V < VCC < 5.25 V; INH = High; all outputs open; – 40 °C < Tj < 150 °C; unless otherwise specified Parameter
Symbol
Limit Values min.
typ.
Unit Test Conditions
max.
SPI-Interface Delay Time from Stand-by to Data In/Power on Reset –
–
100
μs
–
–
–
0.7
–
0.2
–
–
VCC VCC
50
300
500
mV
–
– 50
– 25
– 10
μA
VCSN = 0.7 × VCC
– 50
–
–
μA
VCSN = 0.2 × VCC
Pull down current at pin SDI IISDIL and SCLK (low) (IISCLKL)
10
25
50
μA
Pull down current at pin SDI IISDIH and SCLK (high) (IISCLKH)
–
–
50
μA
–
10
15
pF
VSDI (VSCLK) = 0.2 × VCC VSDI (VSCLK) = 0.7 × VCC 0 V < VCC < 5.25 V
Setup time
tset
Logic Inputs SDI, SCLK and CSN
VIH L-input voltage threshold VIL Hysteresis of input voltage VIHY Pull up current at pin CSN IICSNH H-input voltage threshold
(high)
Pull up current at pin CSN (low)
Input capacitance at pin CSN, SDI or SCLK
IICSNL
CI
–
Note: Input capacitances are guaranteed by design.
Data Sheet, Version 3.2
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TLE 6209 R
3.3
Electrical Characteristics (cont’d)
8 V < VS < 40 V; 4.75 V < VCC < 5.25 V; INH = High; all outputs open; – 40 °C < Tj < 150 °C; unless otherwise specified Parameter
Symbol
Limit Values
Unit Test Conditions
min.
typ.
max.
VSDOH
VCC
VCC
–
V
ISDOH = 1 mA
–
0.25
0.4
V
Tri-state leakage current
VSDOL ISDOLK
– 10
–
10
μA
Tri-state input capacitance
CSDO
–
10
15
pF
ISDOL = – 1.6 mA VCSN = VCC 0 V < VSDO < VCC VCSN = VCC 0 V < VCC < 5.25 V
Logic Output SDO H-output voltage level L-output voltage level
–1.0
–0.85
Note: Input capacitances are guaranteed by design.
Data Sheet, Version 3.2
20
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TLE 6209 R
3.3
Electrical Characteristics (cont’d)
8 V < VS < 40 V; 4.75 V < VCC < 5.25 V; INH = High; all outputs open; – 40 °C < Tj < 150 °C; unless otherwise specified Parameter
Symbol
Limit Values
Unit Test Conditions
min.
typ.
max.
tPSCLK tSCLKH tSCLKL tbef
500
–
–
ns
–
250
–
–
ns
–
250
–
–
ns
–
250
–
–
ns
–
tlead tlag tbeh tSDISU tSDIHO trSIN
250
–
–
ns
–
250
–
–
ns
–
250
–
–
ns
–
125
–
–
ns
–
125
–
–
ns
–
–
–
100
ns
–
–
–
100
ns
–
–
25
50
ns
–
25
50
ns
CL = 100 pF CL = 100 pF
–
–
125
ns
low impedance
–
–
125
ns
high impedance
–
50
125
ns
VDO < 0.2 VCC; VDO > 0.7 VCC; CL = 100 pF
Serial Data Input Timing Serial Clock period Serial Clock high time Serial Clock low time Serial Clock low before CSN low CSN setup time SCLK setup time Clock low after CSN high SDI setup time SDI hold time Input signal rise time at pin SDI, SCLK and CSN
Input signal fall time tfSIN at pin SDI, SCLK and CSN Serial Data Output Timing SDO rise time SDO fall time SDO enable time SDO disable time SDO valid time
Data Sheet, Version 3.2
trSDO tfSDO tENSDO tDISSDO tVASDO
21
2010-09-10
TLE 6209 R
3.3
Electrical Characteristics (cont’d)
8 V < VS < 40 V; 4.75 V < VCC < 5.25 V; INH = High; all outputs open; – 40 °C < Tj < 150 °C; unless otherwise specified Parameter
Symbol
Limit Values min.
typ.
Unit Test Conditions
max.
Thermal Prewarning, Warning and Shutdown Thermal prewarning junction temperature
TjPW
120
140
160
°C
–
Temperature prewarning hysteresis
ΔT
–
20
–
K
–
Thermal warning junction temperature
TjW
140
160
180
°C
–
Temperature prewarning hysteresis
ΔT
–
20
–
K
–
160
180
200
°C
–
Thermal shutdown junction TjSD temperature Temperature shutdown hysteresis
ΔT
–
20
–
K
–
Ratio of W to PW temperature
TjW / TjPW
1.07
1.14
–
–
–
Ratio of SD to W temperature
TjSD / TjW
1.06
1.13
–
–
–
Note: Temperature thresholds are guaranteed by design.
Data Sheet, Version 3.2
22
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TLE 6209 R
4
Diagrams
V 13.2V
VOUT
9V
9V
0
tOFF_xx
IOUT
Figure 4
Switch-OFF time during current limitation (chopper OFF-time)
Vs V Vs
5V PWM 0
OUT
tdSD IOUT ISDH
ISC
GND
Figure 5
Short circuit of high-side switch to GND
Data Sheet, Version 3.2
23
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TLE 6209 R
V PWM Input
5 50%
50%
0
tRISE
tFALL 100% 90%
90%
VOUT 10%
10%
td1
td2
DIR = L / H => VOUT = VOUT 1/2 Resistive load to Vs => tRISE = tRISE L, tFALL = tFALL L td1 = td OFF L, td2 = td ON L
Figure 6
Resistive load to GND => tRISE = tRISE H, tFALL = tFALL H td1 = td ON H, td2 = td OFF H
Output Delay and Switching Time Definitions
CSN High to Low & rising edge of SCLK: SDO is enabled. Status information is transfered to Output Shift Register
CSN time CSN Low to High: Data from Shift-Register is transfered to Output Driver Logic
SCLK
0
2
1
4
3
5
6
7
0
new Data
actual Data 0
SDI
1
2
3
5
4
6
0 +
7
SDI: Data will be accepted on the falling edge of CLK-Signal actual Status
previous Status SDO
_ 0
1 _
_ 2
_ 3
_ 4
_ 5
_ 6
_ 7
0
SDO: State will change on the rising edge of CLK-Signal
old Data
Figure 7
actual Data
Standard Data Transfer Timing
Data Sheet, Version 3.2
24
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TLE 6209 R
CSN High to Low & SCLK stays Low: Status information of Data Bit 0 ( Error Flag ) is transfered to SDO CSN time
SCLK
SDI SDI: Data is not accepted
SDO tristate
_ 0
tristate SDO: Status information of Data Bit 0 ( Error-Flag ) will stay as long as CSN is low
Figure 8
Timing for Error Detection Only
0.7 VCC
CSN 0.2 VCC tSCLKH 0.7 VCC
SCLK 0.2 VCC tlead tbef
tSCLKL
tlag
tSDISU
tbeh tSDIHO
SDI
Don´t care
Don´t care
Valid
0.7 VCC
Valid
Don´t care 0.2 VCC
Figure 9
SPI-Input Timing
Data Sheet, Version 3.2
25
2010-09-10
TLE 6209 R
trSIN
tfSIN 0.7 VCC
SCLK
50 % 0.2 VCC trSDO 0.7 VCC
SDO
( low to high ) 0.2 VCC tVASDO tfSDO 0.7 VCC
SDO
Figure 10
( high to low ) 0.2 VCC
DO Valid Data Delay Time and Valid Time tfSIN
trSIN 0.7 VCC
CSN
50 % 0.2 VCC tENSDO
tDISSDO 10 kΩ Pullup to VCC
SDO
tENSDO
tDISSDO 10 kΩ Pulldown 50 % to GND
SDO
Figure 11
50 %
SDO Enable and Disable Time
Data Sheet, Version 3.2
26
2010-09-10
TLE 6209 R
5
Application
Watchdog Reset Q
TLE 4278G
Z39 D
CQ 22µF
Vbat
I
CD 10nF
100µF
100nF
GND
CDRV WD R
VCC
VCC
DRV
15
MicroController for EMS/ETC Function
INH
9
DIS
12
CSN SDI SCLK SDO
PWM DIR
VS
33nF
16
Bias
Charge Pump
Inhibit
FaultDetect
4,17
8
2,3
6
S
5
P
7
I
OUT 1
Driver
8 Bit Logic and Latch
& 18,19
Gate-Control
OUT 2
M
14 Direct Input
13
UV
GND
≥1 OV Micro-Controller for Evaluation Process Monitoring
TSD
GND
GND
Figure 12
Application Circuit
Data Sheet, Version 3.2
27
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TLE 6209 R
6
Package Outlines
-0.027
B
5˚ ±3˚
0.25 +0.0
11 ±0.15 1) 2.8
1.3
1.2 -0.3
3.5 max.
0 +0.15 3.25 ±0.1
PG-DSO-20-37, -65 (Plastic Dual Small Outline Package)
15.74 ±0.1 1.27
Index Marking
6.3
0.1
0.4 +0.13
0.25
M
20
11
1 1 x 45˚
10
A 20x
14.2 ±0.3
Heatsink 0.95 ±0.15 0.25
M
B
15.9 ±0.15 1)
A 1) Does not include plastic or metal protrusion of 0.15 max. per side
GPS05791
Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Dimensions in mm
SMD = Surface Mounted Device Data Sheet, Version 3.2
28
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TLE 6209 R
7
Revision History
Version
Date
Rev. 3.1
2007-08-01 RoHS-compliant version of the TLE 6209 R • All pages: Infineon logo updated • Page 1: “AEC qualified” and “RoHS” logo added, “Green Product (RoHS compliant)” and “AEC qualified” statement added to feature list, package names changed to RoHS compliant versions, package pictures updated, ordering codes removed • Page 28: Package name changed to RoHS compliant version, “Green Product” description added • Revision History added • Legal Disclaimer added
Rev. 3.2
2010-09-10 Package name updated
Data Sheet, Version 3.2
Changes
29
2010-09-10
Edition 2010-09-10 Published by Infineon Technologies AG 81726 Munich, Germany
© 9/10/10 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
