DESIGN FOR HIGH PERFORMANCE, LOW POWER, AND RELIABLE 3D INTEGRATED CIRCUITS BY SUNG KYU LIM
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DESIGN FOR HIGH PERFORMANCE, LOW POWER, AND RELIABLE 3D INTEGRATED CIRCUITS BY SUNG KYU LIM PDF
Design For High Performance, Low Power, And Reliable 3D Integrated Circuits By Sung Kyu Lim. Provide us 5 minutes and we will reveal you the very best book to read today. This is it, the Design For High Performance, Low Power, And Reliable 3D Integrated Circuits By Sung Kyu Lim that will certainly be your finest option for much better reading book. Your five times will not spend squandered by reading this internet site. You can take guide as a source to make much better concept. Referring guides Design For High Performance, Low Power, And Reliable 3D Integrated Circuits By Sung Kyu Lim that can be located with your requirements is at some time difficult. Yet here, this is so very easy. You could discover the best point of book Design For High Performance, Low Power, And Reliable 3D Integrated Circuits By Sung Kyu Lim that you could review.
From the Back Cover This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of timing, power, signal integrity, and thermo-mechanical reliability for 3D IC designs. Coverage also includes various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the 3D IC design process. ●
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●
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Describes design issues and solutions for high performance and low power 3D ICs, such as the pros/cons of regular and irregular placement of TSVs, Steiner routing, buffer insertion, low power 3D clock routing, power delivery network design and clock design for pre-bond testability. Discusses topics in design-for-electrical-reliability for 3D ICs, such as TSV-to-TSV coupling, current crowding at the wire-to-TSV junction and the electro-migration failure mechanisms in TSVs. Covers design-for-thermal-reliability in 3D ICs, including thermal-aware architectural floorplanning, gate-level placement techniques to alleviate thermal problems, and co-design and co-analysis of thermal, power delivery, and performance. Includes issues affecting design-for-mechanical-reliability in 3D ICs, such as the co-efficient of thermal expansion (CTE) mismatch between TSV and silicon substrate, device mobility and fullchip timing variations, and the impact of package elements.
About the Author Dr. Sung Kyu Lim received his PhD at UCLA in Los Angeles, USA and he majored in VLSI CAD. He recently received tenure at Georgia Tech.
DESIGN FOR HIGH PERFORMANCE, LOW POWER, AND RELIABLE 3D INTEGRATED CIRCUITS BY SUNG KYU LIM PDF
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DESIGN FOR HIGH PERFORMANCE, LOW POWER, AND RELIABLE 3D INTEGRATED CIRCUITS BY SUNG KYU LIM PDF
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process. ● ● ● ●
Sales Rank: #3332627 in eBooks Published on: 2012-11-27 Released on: 2012-11-27 Format: Kindle eBook
From the Back Cover This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of timing, power, signal integrity, and thermo-mechanical reliability for 3D IC designs. Coverage also includes various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the 3D IC design process. ●
●
●
●
Describes design issues and solutions for high performance and low power 3D ICs, such as the pros/cons of regular and irregular placement of TSVs, Steiner routing, buffer insertion, low power 3D clock routing, power delivery network design and clock design for pre-bond testability. Discusses topics in design-for-electrical-reliability for 3D ICs, such as TSV-to-TSV coupling, current crowding at the wire-to-TSV junction and the electro-migration failure mechanisms in TSVs. Covers design-for-thermal-reliability in 3D ICs, including thermal-aware architectural floorplanning, gate-level placement techniques to alleviate thermal problems, and co-design and co-analysis of thermal, power delivery, and performance. Includes issues affecting design-for-mechanical-reliability in 3D ICs, such as the co-efficient of thermal expansion (CTE) mismatch between TSV and silicon substrate, device mobility and fullchip timing variations, and the impact of package elements.
About the Author Dr. Sung Kyu Lim received his PhD at UCLA in Los Angeles, USA and he majored in VLSI CAD. He recently received tenure at Georgia Tech. Most helpful customer reviews 1 of 1 people found the following review helpful. Thorough Treatment of 3D IC Design by a Pioneering Scientist By Theodore D. Huffmire I saw this book at the Springer booth at DAC and immediately ordered it; as a scientific researcher and engineering educator, I immediately understood and appreciated its impact. The author is Dr. Sung Kyu Lim of Georgia Tech, and I have had the great honor of visiting his lab, the Georgia Tech Computer-Aided Design (GTCAD) Lab, last year in Atlanta. Sung Kyu is a very strong scientist who does very solid work. This book, at over five hundred pages and seventeen chapters, is a gift to the scientific and engineering community, and I will be studying it and referring to it for many years in my research. Lim has pioneered the development of 3D IC tools and techniques, and has tapedout cutting-edge, high-performance 3D IC chips in academia, which is an enormous achievement, given the manpower constraints of academia compared with industry. He has mentored numerous talented graduate students who have become leaders in their field. He has created tool flows that transform RTL to GDSII. Lim contributed greatly to the first tape-out of a 3D IC multi-project wafer sponsored by the DoD; this could never have been completed successfully without a very sophisticated tool chain. This book has been thoroughly proofread and has many worked design examples and numerous high-resolution color figures that tell a fascinating story of an emerging technology that offers great performance and power advantages over traditional 2D ICs, though there are significant technical challenges in terms of thermal management, floor planning, mechanical stress, yield, and cost, that are addressed thoroughly in this book. The computer-aided design of a traditional 2D chip is extremely complicated; 3D ICs are even more complicated and challenging. Lim's tool flow leverages existing 2D tools and combines them with new tools to create a 3D IC tool flow. There are many, many steps in the conversion from RTL to GDSII, such as IR-drop analysis, signal integrity analysis, design rule checking, etc., and this book explains the entire process from start to finish. This book tells an inspiring story based on many years of very solid scientific achievement and progress, and I am proud to own it. See all 1 customer reviews...
DESIGN FOR HIGH PERFORMANCE, LOW POWER, AND RELIABLE 3D INTEGRATED CIRCUITS BY SUNG KYU LIM PDF
Yeah, checking out a book Design For High Performance, Low Power, And Reliable 3D Integrated Circuits By Sung Kyu Lim can include your pals checklists. This is among the formulas for you to be successful. As recognized, success does not mean that you have fantastic points. Comprehending and knowing even more compared to various other will certainly offer each success. Next to, the notification and perception of this Design For High Performance, Low Power, And Reliable 3D Integrated Circuits By Sung Kyu Lim could be taken as well as selected to act. From the Back Cover This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of timing, power, signal integrity, and thermo-mechanical reliability for 3D IC designs. Coverage also includes various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the 3D IC design process. ●
●
●
●
Describes design issues and solutions for high performance and low power 3D ICs, such as the pros/cons of regular and irregular placement of TSVs, Steiner routing, buffer insertion, low power 3D clock routing, power delivery network design and clock design for pre-bond testability. Discusses topics in design-for-electrical-reliability for 3D ICs, such as TSV-to-TSV coupling, current crowding at the wire-to-TSV junction and the electro-migration failure mechanisms in TSVs. Covers design-for-thermal-reliability in 3D ICs, including thermal-aware architectural floorplanning, gate-level placement techniques to alleviate thermal problems, and co-design and co-analysis of thermal, power delivery, and performance. Includes issues affecting design-for-mechanical-reliability in 3D ICs, such as the co-efficient of thermal expansion (CTE) mismatch between TSV and silicon substrate, device mobility and fullchip timing variations, and the impact of package elements.
About the Author Dr. Sung Kyu Lim received his PhD at UCLA in Los Angeles, USA and he majored in VLSI CAD. He recently received tenure at Georgia Tech.
Design For High Performance, Low Power, And Reliable 3D Integrated Circuits By Sung Kyu Lim. Provide us 5 minutes and we will reveal you the very best book to read today. This is it, the Design For High Performance, Low Power, And Reliable 3D Integrated Circuits By Sung Kyu Lim that will certainly be your finest option for much better reading book. Your five times will not spend squandered by reading this internet site. You can take guide as a source to make much better concept. Referring guides Design For High Performance, Low Power, And Reliable 3D Integrated Circuits By Sung Kyu Lim that can be located with your requirements is at some time difficult. Yet
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